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半导体晶圆键合
ABSTRACTWhen mirror-polished, flflat, and clean wafers of almost any material are brought into contact at room temperatu...
满足先进半导体器件工艺要求的颗粒清洗技术
Dealing with nanometer-sized particulate contamination is still one of the major challenges during the manufacturing of ...
半导体加工中注入的光刻胶和阻挡金属的氧化去除
ABSTRACTChemical systems containing oxidants are widely used at various stages in semiconductor processing, particularl...
半导体晶片缺陷模式的检测与分类
1. IntroductionThe manufacture of integrated circuits is a complex and costly process that involves hundreds of steps an...
半导体湿式蚀刻和表面制备的工业背景
Abstract.The semiconductor industry is undergoing a transition driven by end use markets. In recent years, mobile devic...
GaN 基金属氧化物半导体器件
1. IntroductionSi-based semiconductors-related technologies are well developed for their applications in electronic devi...
宽禁带半导体技术回顾
AbstractSilicon carbide (SiC) and gallium nitride (GaN) are typical representative of the wide band-gap semiconductor ma...
半导体封装基板材料技术趋势
The electronics industry has developed dramatically over the past halfcenturv. primarily thanks to the semiconductorindu...
半导体器件封装单片化工艺优化
Abstract.With the advancement of semiconductor technology, the assembly processsemiconductor packaging is driving the de...
上海积塔半导体有限公司特色工艺生产线建设项目国际招标公告
招标项目名称:上海积塔半导体有限公司特色工艺生产线建设项目招标产品列表(主要设备): 紫外线烘烤机招标文件领购开始时间:2023-02-10招标文件领购结束时间:2023-02-17投标截止时间（开标时间）:2023-03-03 10:00...