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TSV对3D IC集成系统级封装热性能的影响
Abstract Thermal performances of 3D IC integration system-in-package (SiP) with TSV (through silicon via) interposer/chi...
多晶硅锗的 MEMS 薄膜封装
AbstractThis paper presents an attractive poly-SiGe thin-fifilm packaging and MEM (microelectromechanical) platform tech...
晶圆级芯片封装可靠性的提高
I. INTRODUCTIONIt is estimated that the coming 5G network will connect more than 100 billion devices and deliver fast ra...
快速热退火设备及AMOLED成膜封装设备采购项目国际招标公告
招标项目名称:快速热退火设备及AMOLED成膜封装设备采购项目招标产品列表(主要设备):半自动微波探针台测试系统1套招标文件领购开始时间:2023-03-29招标文件领购结束时间:2023-04-06开标时间:2023-04-19招标人:京...
奕斯伟板级封装系统集成电路项目国际招标公告
招标项目名称:奕斯伟板级封装系统集成电路项目招标产品列表(主要设备):晶圆研磨机、激光开槽机、切割机各1台招标文件领购开始时间:2023-04-03招标文件领购结束时间:2023-04-11开标时间:2023-04-24招标人:成都奕成集成...
奕斯伟板级封装系统集成电路项目中标结果公告
项目名称：奕斯伟板级封装系统集成电路项目项目编号：4197-2340CDECHEN1/03招标产品列表(主要设备):：芯片导入设备5台招标机构：中电商务（北京）有限公司招标人：成都奕成集成电路有限公司开标时间：2023-05-05 10:0...
基于硅的多芯片LED封装
Light emitting diodes (LEDs) not only significantly reduce power consumption compared to incandescence, but also with ...
晶圆级芯片级封装的背面保护
Wafer-level chip scale packages (WLCSPs) certainly rank among the key enablers of smaller, thinner, higher functionalit...
基于GaN电荷注入层封装的半导体纳米晶体的多色发光二极管
Numerous technologies including solid-state lighting, displays, and traffic signals can benefit from efficient, color-se...
晶圆级封装制造工艺及应用进展
Chip scale package (CSP) is defifined as the package that has an area of less than 1.2 times of die size. Due to its sma...