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硅谐振器的晶圆级封装技术
Recently, a family of low frequency silicon resonators with AlN piezoelectric activation has been developed. These devic...
使用 Au-Si 共晶键合和局部加热的低温晶圆级真空封装
Using Au-Si eutectic bonding, devices were encapsulated by bonding a silicon cap wafer to a device wafer. Au-Si eutecti...
高阻多晶硅作为晶圆级封装中的射频基板
Passive components, such as spiral inductors, transmission lines, and antennas, are limiting the performance and reducti...
向异性导电薄膜 (ACF) 的晶圆级倒装芯片封装
Recently, wafer-level packaging (WLP) has become one of the promising packaging technologies due to its advantages, such...
用于射频晶圆级芯片级封装的玻璃基板的可加工性和电气特性
Various types of glass substrates have been compared withrespect to their suitability as a low-loss substrate in wafer-l...
高功率LED封装及应用中的热量和流体流动
Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and t...
奕斯伟板级封装系统集成电路项目国际招标公告基板清洗剥离设备
招标项目名称:奕斯伟板级封装系统集成电路项目招标产品列表(主要设备):基板清洗剥离设备 1招标文件领购开始时间:2023-07-05招标文件领购结束时间:2023-07-12开标时间:2023-07-26 10:00招标人:成都奕成集成电...
智能传感器的晶圆级真空封装
The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for...
通过热释放金属有机膜进行晶圆级 MEMS 封装
This paper reports on the design, implementation and characterization of wafer-level packaging technology for a wide ran...
多孔多晶硅壳表面微加工晶圆上的单片封装
In this paper, we present a novel microfabrication technique that solves the main problems of existing monolithic on-chi...