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光刻胶膜厚均匀性的实时预测控制
Abstract With the trends toward larger wafer size and thelinewidth going below 100 nm, one of the challenges is to contr...
MEMS 应用中不同厚光刻胶的比较研究
This work reports on recent advances in microfabrication process technology for mediumto high-aspect ratio structures re...
用于集成新型 3-D RF 微结构的光刻胶涂层方法
Abstract—This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. ...
光刻胶溶解过程中表面粗糙度的变化
I. INTRODUCTION The tremendous gain in computational speed and storage capacity afforded by miniaturization of the integ...
改善去除负光刻胶效果的方法
Introduction: Inkjet piezoelectric printing technology has an important position in many fifields of printing technology...
微气泡对光刻胶层的影响
1. IntroductionTiny bubbles are a promising candidate for anenvironmentally friendly method of photoresistremoval. It ha...
光刻胶回流特性在金刚石微透镜制造中的应用
Thermal reflflow is a commonly used technique to fabricate microlens features in the photoresist (PR).1 These PR microle...
显影剂强度对模型 EUV光刻胶的图案化能力的影响
The demand for increased functionality and performance of electronic devices is called for by the 30 % shrink and doubl...
用于集成电路制造的光刻胶剥离和或光掩模清洁的工艺顺序
A method and system for cleaning and/or stripping photo resist from photomasks used in integrated circuit manufac turi...
光刻胶溶解的原位表征
Extreme ultraviolet (EUV) photoresist materials and processing are considered as one of the most critical issues in achi...