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金属沉积过程中晶圆制造的颗粒减少
Metal Deposition or metallization process is one of the processes in fabricating a wafer. A wafer is a thin slice of se...
智能传感器的晶圆级真空封装
The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for...
华虹半导体（无锡）有限公司12英寸集成电路制造项目国际招标公告晶圆测试仪
招标项目名称:华虹半导体（无锡）有限公司12英寸集成电路制造项目招标产品列表(主要设备):晶圆测试仪 3招标文件领购开始时间:2023-07-18招标文件领购结束时间:2023-07-25开标时间:2023-08-08 09:30招标人:华...
通过原子氢表面清洁对不同 III-V 化合物半导体进行晶圆键合
Large-area wafer bonding of different III–V compound semiconductors in an ultrahigh vacuum background is demonstrated. T...
用键合和减薄的体压电基板进形 MEMS 的晶圆级制造
We report a batch-mode fabrication technology for integration of bulk piezoelectric materials into MEMS devices, and t...
高度均匀的 300 mm晶圆级沉积的石墨烯薄膜的单层和多层化学衍生
The deposition of atomically thin highly uniform chemically derived graphene (CDG) films on 300 mm SiO2/Si wafers is re...
通过热释放金属有机膜进行晶圆级 MEMS 封装
This paper reports on the design, implementation and characterization of wafer-level packaging technology for a wide ran...
多孔多晶硅壳表面微加工晶圆上的单片封装
In this paper, we present a novel microfabrication technique that solves the main problems of existing monolithic on-chi...
晶圆级热压键的表征
Thermocompression bonding joins substrates via a bonding layer. In this paper, silicon substrates were bonded using gold...
用于制造光学质量、大型连续膜的晶圆级膜转移工艺
F UTURE ultralarge telescopes are currently envisioned by the National Aeronautics and Space Administration (NASA) and o...