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用于后端晶圆级 3D 超集成的介质粘合剂晶圆键合
Approaches to monolithic wafer-level threedimensional integrated circuits (3D ICs) generally involve bonding of process...
离子注入和直接晶圆键合的单晶铁电薄膜
Unfortunately, the temperature window of perovskite oxides is rather narrow making the layer transfer a relatively diffi...
超薄DVS-BCB 将 III-V晶圆、裸片和多个裸片粘合到图案化的绝缘体上硅衬底
Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerge...
通过倒装芯片和晶圆级对准的选择性低温微帽封装技术
In this study, a new technique of selective microcap bonding for packaging 3-D MEMS (Micro Electro Mechanical Systems) d...
小尺寸和超薄MEMS 封装，通过硅帽的转移键合实现晶圆级真空密封
Vacuum and hermetic packaging is a critical requirement for optimal performance of many micro-electromechanical systems ...
通过重复使用臭氧水和稀 HF 的单晶圆旋转清洁去除污染物
We have developed a new technique of single-wafer spin cleaning at room temperature, while alternately supplying ozonize...
SPM 溶液对抛光 SiO2 薄膜和吸附二氧化铈纳米颗粒对单晶圆清洗的热影
Caria nanoparticles which have been used to remove SiO2 film rapidly and selectively form Ce-O-Sibonds with proposed che...
晶圆清洁工艺评估准备的测试硅晶圆的老化效应
This paper presents an experimental study of the aging of contaminated testwafers prepared for particle removal (cleanin...
晶圆级单晶金刚石的常用工艺
Large size single crystal diamond (SCD) wafer has been strongly desired for various of advancedapplications, while two m...
晶圆干燥的基础和技术
The commercial rotary dryers used to dry wood wafers (of approximate dimensions 0.63 mmthick, 50 mm wide and 76+ mm long...