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玻璃料晶圆对晶圆键合的实验和数值研究(1)
Abstract: A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit material a...
用于大规模异构集成的低损耗和宽带晶圆级光学中介层
Abstract: We design, fabricate, and demonstrate a low-loss and broadband optical interposer with high misalignment toler...
低温下在硅晶圆上单步碳化硅异质外延
ABSTRACT A single step growth approach for wafer-scale homogeneous cubic silicon carbide (3C-SiC) heteroepitaxy, using ...
通过优化阴影蒸发技术改善晶圆尺度均匀性
One of the practical limitations of solid-state quantum computer manufacturing is the low reproducibility of the superc...
半导体封装过程中晶圆缓冲区缺陷检测
Abstract Efectively detecting defects in wafer bufer zones is crucial in semiconductor manufacturing processes. If defec...
通过缓冲层控制进行晶圆级单晶 MoS2单层外延
Monolayer molybdenum disulfide (MoS2), an emergent two-dimensional (2D) semiconductor, holds great promise for transcend...
双面化学机械抛光过程中晶圆表面平整度影响​​因素的数值分析
Abstract: Enhancing the levelness of the wafer surface can be achieved by increasing the homogeneity of the radial moti...
光子波导的 CMOS 兼容 6 英寸晶圆集成和均匀性分析
Abstract: In this work, we demonstrate photonic fabrication by integrating waveguide resonators and groove structures us...
通过全夹层晶圆安装技术改进半导体芯片
ABSTRACT: Silicon wafers have been widely used in semiconductor manufacturing, and chipping issues often highlighted dur...
用于低温电子应用的 SiN 薄膜的晶圆级制造和表征
This thesis focuses on developing novel components for cryoelectronics applications, particularly aiming to realize cont...