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晶圆级 CMOS 兼容石墨烯约瑟夫森场效应晶体管
Abstract. Electrostatically tunable Josephson field-effect transistors (JoFETs) are one of the most desired building blo...
用于微系统封装的 Cu-Sn-In 固液互扩散低温晶圆级键合
ABSTRACT This work demonstrates the potential use of Cu-Sn-In metallurgy for wafer-level low-temperature solid-liquid i...
纳米压印光刻用于 200 mm 晶圆中 MEMS 反射镜的灰度图案复制
ABSTRACT In this work a multilevel nanoimprint lithography (NIL) replication process was demonstrated to produce 1D ME...
机械柔性晶圆级集成光子制造平台
The feld of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integratedphotonics platforms...
高通量在线硅晶圆检测中的定量剪切应力成像
ABSTRACT Defect inspection methods are basic steps in electronic chip manufacturing and power device production process...
通过芯片到晶圆混合键合实现多层芯片堆叠
Abstract—A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively...
湿度和表面粗糙度对晶圆直接键合的影响
Abstract. Bodies made from elastically stiff material usually bind very weakly unless the surfaces are flat and extremel...
单片芯片的电化学器件和半导体的晶圆级异质集成
ABSTRACT Micro-scale electrochemical devices, despite their wide applications and unique potential to achieve ‘More than...
碳化硅独立光子器件的晶圆级集成
Abstract Color center platforms have been at the forefront of quantum nanophotonics for applications in quantum networki...
Single Wafer Clean
单晶圆清洗的清洗过程是在室温下重复利用 DI-03/DHE 清洗液进行的，臭氧化的 DI水(DI-03)用来产生氧化硅，稀释的 HF 用来蚀刻氧化硅，同时清除颗粒和金属污染物。根据蚀刻和氧化的要求，采用较短的喷淋时间就可获得较好的清洗效果，...