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采用全覆盖超音速旋转工艺的高效晶圆背面清洁
A single wafer cleaning system with full coverage back-side megasonics has been developed for pre-lithography backside c...
晶圆背面清洁工艺
Abstract –With each new advanced technology node, minimum feature sizes continue to shrink. As a result, the devices bec...
高效单晶圆清洗工艺
Abstract. Current work describes development, testing and verification of a single wafer megasonic cleaning method util...
堆叠结构的晶圆及其减薄方法
Abstract— Wafer-to-wafer 3D integration has a potential to minimize the Si thickness, which enables us to connect mult...
MEMS 器件的金属晶圆键合
AbstractMetal fifilms can be used as bonding layers at wafer-level in MEMS manufacturing processes for device assembly a...
通过原子氢表面清洁实现GaAs晶圆键合
A method of large-area wafer bonding of GaAs is proposed. The bonding procedure was carried outin an ultrahigh vacuum. T...
使用晶圆键合机的晶圆级芯片规模封装
ABSTRACTAn in-house processing capability is developed in this research for silicon-glass bonding for microfabrication a...
有机污染物在晶圆表面的吸附行为
ABSTRACTSilicon wafers can adsorb volatile organic compounds present in the air of the enclosed environmentsin the clean...
晶圆级封装的可靠性分析
AbstractWafer level packaging (WLP) has been growing continuously in electronicspackaging due to its low cost in batch m...
晶圆上金刚石薄膜的化学辅助机械抛光
AbstractDiamond has been well recognized a strategic engineering material. It possesses excellentphysical and chemical p...