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晶圆键合制造技术回顾
AbstractTechniques for fabricating strained Si, SiGe, and Ge on-insulator include SIMOX, Ge condensation and waferbondin...
使用晶圆级方法评估设备可靠性
ABSTRACT:This paper demonstrates the viability of wafer-levelmethods as a means of evaluating device reliability usingsp...
MEMS制造应用的晶圆级气密封装
AbstractIn order to simplify the processing complexity andcut down the manufacturing cost, a new wafer bonding technique...
晶圆级键合工艺
Abstract The objective of this study was to develop a fullyintegrated process for wafer level MEMS packagingutilizingPol...
晶圆级微光学制造
AbstractMicro-optics is an indispensable key enabling technologyfor many products and applications today. Probably the m...
自动化超薄晶圆生产的处理
ABSTRACT: New approaches for future photovoltaic cell concepts issue a challenge to crystalline wafer handlingEspecially...
快速扩大 GaAs晶圆背面处理的挑战
ABSTRACTThe dramatic increase in demand for GaAs basedpHEMT and HBT devices has required the expansion ofwafer FAB capac...
通过晶圆减薄提高 WL-CSP 的可靠性
Abstract WL-CSP is a low profile, true chip size package that is entirely built on a wafer using front-end and back en...
用于高密度晶圆互连的微加工晶圆减薄
Abstract ¾ Thinning of micromachined wafers containing trenches and cavities to realize through-chip interconnects is pr...
表面粗糙度对晶圆直接键合的影响
I. INTRODUCTION The mechanism of direct wafer bonding at room temperature has been attributed to the short range intermo...