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晶圆级石墨烯集成电路
A wafer-scale graphene circuit was demonstrated in which all circuit components, including graphene field-effect transis...
晶圆级微光学工艺
ABSTRACT Micro-optics is an indispensable key enabling technology (KET) for many applications today. The importan...
晶圆级制造的热气动可调微透镜
We have developed a self-contained, liquid tunable microlens based on polyacrylate membranes integrated with compact on-...
晶圆键合的基本问题
Semiconductor wafer bonding has increasingly become a technology of choice for materials integration in microelectronics...
外延晶圆中金属污染的表征
Metal contamination is the dominant cause of device failure. In the case of an epitaxial (Epi) wafer, trace metal may we...
晶圆干燥工艺中清洁技术的发展
Abstract In the aqueous processing of silicon wafers, drying of wafers must take place after each processing step. Howev...
去除晶圆表面颗粒的方法
Abstract: A big yield drop has been observed during the automatic inspection (AOI) after the saw stage. A step by step A...
InGaAsP晶圆的化学蚀刻
ExperimentalThe InGaAsP/InP DH wafers employed were grownby low temperature liquid phase epitaxy (13).Theepitaxial layer...
晶圆干燥的基本原理和技术
IntroductionPrevious research efforts on the drying of wood products have focussed primarily on thedrying of lumber. Alt...
晶圆级芯片封装可靠性的提高
I. INTRODUCTIONIt is estimated that the coming 5G network will connect more than 100 billion devices and deliver fast ra...