湿法解决方案 半导体资材 泛半导体湿法实验室 数据库
晶圆相关内容
当前位置： 网站首页 TAG: 晶圆
通过在玻璃上旋涂的低温晶圆键合
Wafer bonding techniques have been developed to integrate two lattice mismatched materials and devices.1,2 The limitatio...
上海集材汇智集成电路技术有限公司自动晶圆表面处理器采购项目国际招标公告
招标项目名称:上海集材汇智集成电路技术有限公司自动晶圆表面处理器采购项目招标产品列表(主要设备):自动晶圆表面处理器 1招标文件领购开始时间:2023-05-11招标文件领购结束时间:2023-05-18开标时间:2023-06-09 10...
晶圆级微透镜阵列的设计与制造
Abstract: Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest becaus...
湿清洗后晶圆旋转速度对金属线的影响
The effects of wafer spin speed during a wet cleaning process after dry etching of a metal line patterning was investiga...
晶圆清洗：湿法仍然领先
There are two principal methods of cleaning wafers: gas-phase - dry cleaning - (Figs. 1 & 2) and liquid phase - wet cle...
大直径硅晶圆在单晶炉高温高速热处理过程中的热行为
Thermal behavior of 200-mm- and 300-mm-diameter Si (100) wafers during high-temperature rapid thermal processing (RTP) i...
硅与玻璃晶圆键合的键合能研究
The bonding energy plays a significant role in wafer bonding. The temperature dependence of the bonding energy has been ...
晶圆级芯片级封装的背面保护
Wafer-level chip scale packages (WLCSPs) certainly rank among the key enablers of smaller, thinner, higher functionalit...
半导体晶圆清洗站多化学品供应系统的讨论
Abstract: A multi-chemical supply system is developed and applied to a wet station, which uses the multi-chemical proces...
高效太阳能电池的晶圆清洗程序比较
A number of wafer cleaning technologies compete for the use in high efficiency solar cell processing. Some are borrowed...