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通过晶圆键合的硅光子学
Photonic integrated circuits offer the potential of realizing low-cost, compact optical functions. Silicon-on-insulator...
晶圆级激光光刻
Mechanisms for laser-driven pyrolytic deposition of micron-scale metal structures on crystalline silicon have been stud...
晶圆级石墨烯的红外光谱
We report on spectroscopy results from the mid- to far-infrared on wafer scale graphene, grown either epitaxially on sil...
超薄半导体晶圆应用及工艺
Three factors have concentrated development on thinner wafers: the demand for a low package height for chip cards and RF...
晶圆级封装制造工艺及应用进展
Chip scale package (CSP) is defifined as the package that has an area of less than 1.2 times of die size. Due to its sma...
电感耦合等离子体中原子层蚀刻对晶圆级均匀性的影响
Atomic layer etching (ALE) typically divides the etching process into two self-limited reactions. One reaction passivat...
硅谐振器的晶圆级封装技术
Recently, a family of low frequency silicon resonators with AlN piezoelectric activation has been developed. These devic...
晶圆电互连应用的通孔制造技术比较
Several techniques for fabrication of through-wafer vias in silicon have been compared in terms of achievable via diam...
半导体晶圆热扩散系数测量的光热偏转方法
The photothermal deflflection technique is applied in transverse confifiguration to measure the thermal diffusivity of s...
锗（Ge）晶圆清洗液开发
In this paper, we worked on development of cleaning solution for Ge surface and characterization from the electrical po...