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湿法清洗中颗粒去除的新概念
AbstractFor the manufacturing of submicron or deep submicron ULSIs, it is important to completely suppress particles and...
超细金属颗粒在硅片表面的行为
Keywords: Wafer cleaning, surface preparation, wet etch, scaling, semiconductor trendsAbstract. The semiconductor indust...
硅片上亚微米颗粒的去除方法
In order to successfully clean particulate contamination from wafer surfaces, it isnecessary to understand the adhesion ...
RCA清洁变量对颗粒去除效率的影响
AbstractShrunkenintegrateddevicepatterningformanufacturing requires surface cleanliness and surface smoothness inwet che...
化学品供应量对湿式清洁槽中颗粒去除能力的影响
We found that a wet clean bath that has an interval chemical supply and a frequent fow change was quite eftective for im...
稀释HF清洗过程中硅表面颗粒沉积的机理
The mechanism of particle deposition onto silicon wafer suraces during dilute HF cleans is discussed. Direct surface for...
纳米颗粒薄膜的图案光刻技术
A lithographic approach to generate clean palterms of multiple types of nanoparticles on one 4-inch silicon wafer is dem...
半导体制造中与湿法加工相关的颗粒沉积和去除
Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated cir...
沉积方法对颗粒去除效率的影响
In semiconductor manufacturing, wafer surface cleaning is one of the most important processes as the integration densi...
不同沉积介质对颗粒粘附和去除的影响
The purpose of this study is to investigate the effect of the different deposition mediums on the adhesion and removal o...