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去除晶圆表面颗粒的方法
Abstract: A big yield drop has been observed during the automatic inspection (AOI) after the saw stage. A step by step A...
高温IPA过滤器颗粒去除效率评价
INTRODUCTIONThe need of isopropyl alcohol (IPA) for wafer drying hasbeen increasing in the semiconductor industry, becau...
KOH刻蚀的颗粒沉积
KOH etching is widely used in connection with micromachining of microelectromechanical systems ~ MEMS! . As an example, ...
ZnO纳米颗粒生长的简单湿化学法晶体结构分析
1. Introduction ZnO as II-VI semiconductor material with wide band gap energy of 3.34 eV and large exciton binding ener...
Cu CMP后清洗中添加剂对颗粒粘附和去除的影响
Cu has been widely accepted as an interconnection material in deep submicrometer multilevel device applications because ...
低温微固体氮颗粒及其在半导体晶片清洗技术中的应用
Abstract. The ultra-high heat flflux cooling characteristics and impingement behavior of cryogenic micro-solid nitrogen ...
无颗粒晶圆清洗干燥技术
COMPLETE elimination of all possible impurities from semiconductor processing environments is very important for realiz...
独立晶片表面颗粒沉积的数值分析
ABSTRACT. Numerical analysis was performed to characterize the particle deposition behavior on a horizontal freestanding...
各种薄膜颗粒有效湿清洗方法的评价
Conventional manufacturing process of a metal– oxide–semiconductor (MOS) involves various steps such as etching, deposi...
紫外激光去除硅晶片中的小金属颗粒
Laser removal of small 1 mm sized copper, gold and tungsten particles from silicon wafer surfaces was carried out using ...