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湿法清洗中颗粒去除的新概念
AbstractFor the manufacturing of submicron or deep submicron ULSIs, it is important to completely suppress particles and...
硅片湿法清洗槽中兆声波下的水和气泡运动
The influences of a megasonic wave on water and bubblemotions in a wet cleaning bath used for 300 mm-diameter siliconwaf...
基于稀释化学和臭氧的晶片的高级湿法加工
The photovoltaic (PV) industry has been in a state of rapid growth for the last several years.leading to a production ca...
新型选择性湿法加工
AbstractA new selective processing technique based on a confineddynamic liquid dropmeniscus is presented. This approach ...
半导体制造中与湿法加工相关的颗粒沉积和去除
Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated cir...
实现新的硅表面处理标准的湿法清洁方法
Oxide and Hydride Silicon Surface Termination Oxide terminating cleans suffice for processes that don’t restrict a subse...
用于高效太阳能电池的优化湿法工艺和 PECVD
Keywords: heterojunction, texturization, PECVDIntroduction The semiconductor industry considers wet cleans to be critic...
去除氧化物的湿法HF蚀刻和蒸汽HF蚀刻的比较
ABSTRACTIn this work the etching of different Si-oxide (thermal oxide, TEOS as -deposited, TEOS annealed and PSG anneale...
湿法清洗后氢封端表面的原子级分析
Atomically resolved scanning tunneling microscopy observations are performed on hydrogen-terminated Si(110) surfaces aft...
晶圆湿法清洗的速率检测器
In semiconductor substrate (wafer) cleaning, wet cleaning is essential. Wet cleaning may include both chemi cal and me...